What kind of expectations does Samsung Elec have for the luxury chip packaging industry?
Co-CEO Kye-Hyun Kyung of Samsung Electronics (005930.KS), which opened a new page, stated on Wednesday that the company anticipates making at least $100 million from its next line of sophisticated chip-packaging devices this year.
Advanced chip packaging was established by Samsung as a business unit a year ago, and Kyung stated he anticipates that the company’s investment would start to show benefits in the latter part of this year. In Samsung’s yearly general shareholders’ meeting, Kyung spoke.
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According to Kyung, Samsung’s memory chip division aims to outperform its market share in terms of earnings this year. Data source TrendForce reports that in the fourth quarter of last year, Samsung’s market share for DRAM chips—which are utilized in electronic devices—was 45.5%.
In order to do this, Samsung is mass-producing the HBM3E, a 12-stack variant of high-bandwidth memory (also called HBM) chips, in an effort to get a competitive edge in the high-end memory chips needed to meet the rapidly growing demand for artificial intelligence.
In order to meet client demands, Samsung plans to leverage its centralized memory chip, chip contract manufacturing, and chip design divisions for the upcoming HBM4 generation of chips, which is anticipated to be introduced in 2025 and feature more customizable designs, according to Kyung.
In response to a query from a shareholder regarding Samsung’s recent loss in the HBM market relative to competitor SK Hynix (000660.KS), starts new tab, Kyung stated: “We’re more ready to avoid that from happening anymore in the future”.
The opening of a new tab by Nvidia (NVDA.O) on Wednesday saw a 6.04% increase in Samsung Electronics shares, which is expected to be the largest one-day spike since early September. According to CEO Jensen Huang, Samsung’s HBM chips are being approved for usage by the leader in AI semiconductors. Kyung said that Samsung anticipates significant outcomes soon from additional memory products being researched for AI application, such as compute express link (CXL) as well as processing-in-memory (PIM) devices.
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